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DS1557 4Meg, Nonvolatile, Y2K-Compliant Timekeeping RAM
16 of 17
AC TEST CONDITIONS
Output Load: 50 pF + 1TTL Gate
Input Pulse Levels: 0 to 3.0V
Timing Measurement Reference Levels:
Input: 1.5V
Output: 1.5V
Input Pulse Rise and Fall Times: 5 ns
NOTES:
1) Voltage referenced to ground.
2) Typical values are at 25
C and nominal supplies.
3) Outputs are open.
4) Battery switchover occurs at the lower of either the battery voltage or VPF.
5) The
IRQ/FT and RST outputs are open drain.
6) Data-retention time is at +25
C.
7) Maxim recommends that PowerCap Module bases experience one pass through solder reflow oriented
with the label side up (“live-bug”).
8) Hand soldering and touch-up: Do not touch or apply the soldering iron to leads for more than
3 seconds. To solder, apply flux to the pad, heat the lead frame pad, and apply solder. To remove the
part, apply flux, heat the lead frame pad until the solder reflow, and use a solder wick to remove
solder.
9) tAH1, tDH1 are measured from WE going high.
10) tAH2, tDH2 are measured from CE going high.
11) tWC = 200ns.
PACKAGE INFORMATION
For the latest package outline information and land patterns, go to www.maxim-ic.com/packages. Note that a “+”, “#”, or “-”
in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing
pertains to the package regardless of RoHS status.
PACKAGE TYPE
PACKAGE CODE
OUTLINE NO.
LAND PATTERN NO.
34 PWRCP
PC2+1
21-0246
—
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